ECU, ADAS, and zonal controllers must survive temperature cycles, vibration, and long service life. Ziitek supplies automotive-lean TIM documentation, gap pads for housing interfaces, and PCMs for power-dense stages — coordinated with your validation plan.
Ziitek supplies thermal interface materials, foam sealing, and selective heating across the automotive electronics stack — battery packs and BMS, inverters and e-drives, ADAS cameras and lidar, LED headlamps, e-pumps, and zonal controllers. IATF-aware documentation, PPAP-friendly lot control, and validated grades on EV programs let Tier-1 and pack customers second-source against imported pads with predictable resistance from −40 °C to 125 °C dwells.
Scene challenges
Solution value
Modern vehicle programs concentrate silicon into sealed housings — zonal ECUs, e-axle inverters, ADAS sensor pods, BMS slave boards, lighting drivers — while keeping the same expectations on durability and EMC. Ziitek's portfolio spans the four jobs that show up across those housings: conduct heat between die and lid, fill manufacturing tolerance without aggressive clamp, seal the box against ingress, and selectively add heat where chemistry needs it.
The TIF, TIC, and Z-foam families that ship into power-tool, server, and consumer electronics platforms are the same families qualified on EV pack, motor, and inverter programs — the difference is the documentation discipline and the validation plan, not the chemistry shelf.
Automotive electronics teams need predictable behaviour across −40 °C to 125 °C dwells and tens of thousands of thermal cycles, not just spec-sheet conductivity. Ziitek tunes filler loading and carrier chemistry on customer hardware so junction-to-case data on the customer's own controller, inverter, or BMS bench matches incumbents — even where rated bulk conductivity sits lower. Engineering change discipline, banked samples ahead of production switches, and PPAP-friendly data packages align with supplier-quality processes typical of IATF-certified Tier-1 and pack-integrator customers.
Ziitek materials are deployed on passenger-car battery packs (prismatic-cell programs at multiple Chinese OEMs, e-bike and two-wheel EV motor controllers), e-drive and motor platforms, traction inverters, and energy-storage packs that share the same thermal physics. The two-wheel EV motor controller case above is one example of the iterative, hardware-in-loop filler tuning that turns a portfolio grade into a qualified domestic second source against an imported incumbent. Tier-1 OEMs, pack customers, and motor/e-drive customers — referenced in Ziitek's industry roster — anchor the volume base that keeps lot control, change discipline, and global engineering support viable for new automotive programs.
LEAPMOTOR e-axle program — Ziitek TIF200 gap pads and TIF045-05 single-part gel manage stator and inverter heat paths.
Motor-controller power stage with Ziitek TIF gap pads stenciled onto MOSFET dies before housing close-out.
Traction-inverter cooling cutaway — TIF100 pads and TIF020-19 single-part gel bridge IGBT modules to the liquid-cooled baseplate.
Ziitek automotive grades ship with RoHS, REACH, and SVHC declarations, UL94 V-0 flame rating, and lot traceability aligned to IATF 16949 supplier-quality processes. Z-foam 800 carries UL 94 V-0 (UL E331100) and UL 157 (MH66719) listings. Where customer programs require PPAP-aligned change control, banked samples ahead of production switches, and predictable behaviour across −40 °C to 125 °C thermal-cycle dwells, Ziitek's engineering team builds the documentation pack alongside the engineering sample shipment.
Ziitek's automotive-electronics portfolio is qualified against imported PCM pads on live motor-controller, pack, inverter, and ADAS programs, with verified resistance to pump-out, predictable performance across automotive thermal cycles, and PPAP-aware documentation. The TIF100 / TIF200 / TIF020AB / TIC800K-2 / Z-foam 800 family is the reference configuration we recommend for new Tier-1 and pack-integrator programs.
Application position | Recommended model | Key specification |
|---|---|---|
Cell ↔ cooling plate (prismatic / pouch) | TIF100 / TIF200 | Soft silicone gap pad, modulus tuned to module clamp |
Cell-to-plate irregular gap (auto-dispensed) | TIF020AB-02S | Two-part thermal gel, automated dispense |
MOSFET / power-stage stack | TIC800K-2 | ~1.8 W/m·K phase change, pump-out resistant under road vibration |
DC-link cap / IGBT module gap | TIF100-K1 | Reinforced silicone pad, vibration-stable bondline |
Stator-to-housing / e-axle | Single- and two-part thermal gels | |
Pack housing seal | Closed-cell silicone foam, UL 94 V-0, IP68 / IPX9K at 50% compression | |
Cold-climate pack pre-heat | Polyimide and silicone-rubber film heaters, zoned segments |
Ziitek lighting grades ship with RoHS, REACH, and UL94 V-0 documentation alongside long-cycle aging records that support TM-21 worksheets, L70 / L90 reliability models, and DLC / utility-rebate filings. Low-bleed, low-outgassing chemistry selection is verified for silicone optics, reflectors, and sealed lens stacks. Where customer programs require interface-resistance data appropriate to a specific stack, cut-to-width roll formats for linear MCPCBs, or qualification samples sized to EVT, Ziitek's application engineering supplies the data and the cut proofs inside the lighting-program cadence.
Ziitek's LED-lighting portfolio is qualified against the same chemistry families that ship into industrial photonics and high-power emitter cooling, with low-bleed, color-stable, low-outgassing discipline appropriate to silicone optics and IP-rated castings. The TIF / TIC / TIR / Thermal Gel family is the reference configuration we recommend for new COB, driver, and outdoor sealed luminaire programs.
Application position | Recommended model | Key specification |
|---|---|---|
MCPCB ↔ heatsink (primary path) | Silicone Thermal Pad (TIF) | Soft, low compression set, low-bleed |
COB ↔ coin / slug (high-flux) | Phase Change Material (TIC) | Thin PCM layer, high-conductivity option |
Driver / magnetics enclosure | TIF + TIC | Gap pad for voltage standoff plus PCM for electrolytic-adjacent hot spots |
Linear / strip MCPCBs | TIF cut-to-width roll | Continuous-roll formats, trim in-line |
Outdoor / sealed luminaire | TIF + Thermal Gel | Low-outgassing silicone pad plus gel for casting-mismatch gaps |
Large casting in-plane spreading | Thermal Graphite Sheet (TIR) | In-plane spreader across cast-housing CTE mismatch |
Stage / projection / specialty high-power | Thermal Gel (~6 W/m·K class) | Cleanliness and conformability proven on industrial light-source emitter |
Industrial fiber-laser pump module — TIF060-16 thermal gel applied at the diode-pump and gain-module interfaces; the same chemistry maps directly into high-power LED stage and projection fixtures.
Single-component thermal gel close-up — the workflow Ziitek uses for industrial photonics translates directly to high-flux LED COB modules and specialty lighting heads.
From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 7,000+ clients across EV, 5G, and consumer electronics.
