Thermal gel and putty

Dispensable thermal interface compounds for high-volume automated assembly. 30 TIF gel grades — single-part putty (apply and use), two-part cure-in-place (mix A+B), and wave-absorbing variants for combined thermal + EMI duty. λ 1.5–9.0 W/m·K across the family.

30

TIF gel grades

1.5–9.0 W/m·K

Thermal conductivity (λ)

Single + two-part

Cure schedules

−40 – 200 °C

Operating range

Wave-absorbing variants

Combined thermal + EMI

Part numbers & datasheets

Every Thermal putty and thermal gel grade, one table

All 30 thermal putty and thermal gel part numbers with thermal conductivity (W/m·K), colour notes, and PDF datasheets. Click a model name with a link for full specs, photos, and application guidance.

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Technical envelope

Typical specification window (thermal putty & gel)

Typical specification envelope for this product category
ParameterTypical range / noteMethod
Thermal conductivity (nominal)≈ 1.5 – 9+ W/m·K classASTM D5470
Gap fill (cured / in-place)0.1 – several mm — grade-specificStack-up
One-part vs two-partBoth availableProduct family
Hardness / modulusCured-gel dependentShore / DMA
Continuous-use temp.−40 °C to 200 °C classUL746B / TDS
Dielectric strengthGrade-specific kV/mmASTM D149
Shelf & mix ratio (2K)Per datasheet
ApplicationAuto-dispense, manual
Custom packagingCartridge, pail — on request

* Representative grades. Request a lot-specific datasheet or CoA for your exact part number.

FAQ

Thermal putty and thermal gel — common questions

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What's the difference between thermal gel, grease, and putty?

All three are dispensable TIMs but differ in rheology and cure. Grease (TIG) is liquid-like, sub-50 µm bondline, and can pump out under cycling. Putty (single-part TIF0xx) is a stiffer, paste-like one-time application that holds its shape after dispense — bondlines run 100 µm to 1 mm. Two-part gel (TIF0xxAB) is mixed then cures into a permanent soft elastomer (Shore 00) — gives gasket-like sealing plus thermal transfer. Pick by: bondline thickness, automated-dispense compatibility, and whether you want a permanent set.

Single-part dispense-and-use vs two-part cure — when do I want which?

Single-part is faster on the line: apply, place the heatsink, ship. No pot-life clock, no mix-ratio control. Suits high-volume automotive and consumer electronics. Two-part is preferred when (a) the assembly will see vibration that would migrate uncured gel, (b) the joint must seal against fluids or gas after cure, or (c) you need a permanent soft elastomer that won't flow with temperature. Two-part has a measurable working life (typically 30 min – 24 h depending on grade) so dispensers must be timed correctly.

What does 'wave-absorbing' (TIF0xx-WA) mean?

Wave-absorbing thermal gels combine thermally conductive ceramic fillers with EMI-absorbing magnetic powders — same physical layer does dual duty: heat conduction (typically 3–5 W/m·K) plus radio-frequency absorption (peak ~17 dB at 8–14 GHz on TIF030-WA / TIF050-WA). Use cases are 5G mmWave radio modules, automotive radar, and SerDes interconnects where standing-wave reflections degrade signal integrity. Saves a separate ferrite tile.

What's the right bondline thickness for thermal gel?

Single-part putty typically dispenses as a controlled bead (volumetric pump or auger) and squeezes to 100–500 µm under assembly clamp. Two-part cured gel sets at the dispensed thickness (300 µm – 1 mm common) — clamping during cure compresses to target. Lower bondline always means lower thermal resistance, but gel's value is exactly when surface flatness or stack tolerance prevents reliable sub-100 µm application. If you can hit 50 µm flat, use grease; if you can't, use gel.

Can I rework a gel-installed assembly?

Single-part putty is removable with isopropanol and a plastic scraper — cleaner reworks than cured silicone. Two-part cured gel forms a soft solid (Shore 00 hardness) that peels off with care, similar to a gap pad. Wave-absorbing gels rework like the parent dispense form. None of these reworks bring the joint back to factory thermal performance — re-application is required, and the cured-gel residue must be fully cleaned before bonding a fresh layer.

Are these gels silicone-based?

Yes — TIF0xx gels are silicone matrix. For silicone-sensitive applications (optical sensors, MEMS, hermetically sealed assemblies that fail under siloxane outgassing), specify a non-silicone alternative — Z-Paster non-silicone pads handle this duty though they don't dispense. We can advise on silicone-free dispensable options on request; not all conductivity grades are available in non-silicone form.

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