TIF100-18-02S Silicone Thermal Pad
- Breakdown Voltage (V/mm)
- ≥5500
- Density (g/cm³)
- 2.65
- Dielectric Constant @1MHz
- 4.5
- Flame Rating
- V-0
- Hardness (Shore OO)
- 45~65
- Recommended Operating Tem…
- -40~200
TIF100-18-02S — Product overview
TIF®100-18-02S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
TIF100-18-02S — Features
Good thermal conductivity
Good softness and fillability
Self-adhesive without the need for additional surface adhesives
Good insulation performance
Where this grade is used
Typical application targets for this grade include Home appliance industry, Power module, Wearable device, Solar photovoltaic panel, LED lighting fixtures.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
TIF100-18-02S — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF100-18-02S_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Gray White | Visual |
| Construction | Ceramic filled silicone elastomer | — |
| Thickness Range | 0.010~0.020" (0.25~0.50 mm) / 0.030~0.200" (0.75~5.00 mm) | ASTM D374 |
| Hardness (Shore OO) | 65 / 45 | ASTM D2240 |
| Density (g/cm³) | 2.65 | ASTM D792 |
| Recommended Operating Temperature (°C) | -40~200 | — |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 4.5 | ASTM D150 |
| Volume Resistivity (Ω·cm) | >1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m·K) | 1.8 | ASTM D5470 |
| Thermal Conductivity (W/m·K) | 1.8 | — |
| Flame Rating | V-0 | UL94 (E331100) |
* Match values to the PDF revision cited on your purchase order.
Related silicone thermal pads models
| Model | Series | λ (W/m·K) | Hardness | View |
|---|---|---|---|---|
| TIF100-10-02S | TIF100 | 1 W/m·K | 45 | Details |
| TIF100-12-66U | TIF100 | 1.2 W/m·K | 27~65 | Details |
| TIF100-15-11U | TIF100 | 1.5 W/m·K | 27~65 | Details |
| TIF500-18-11US | TIF500 | 1.8 W/m·K | 20~65 | Details |
| TIF100-20-05E | TIF100 | 2 W/m·K | 35~65 | Details |
| TIF200-20-14S | TIF200 | 2 W/m·K | 45±5 | Details |
| TIF400 | TIF400 | 2 W/m·K | 45 | Details |
| TIF500-20-01U | TIF500 | 2 W/m·K | 27±5 | Details |
TIF100-18-02S — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF100-18-02S?
The customer workbook lists nominal through-plane conductivity as 1.8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF100-18-02S die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF100-18-02S?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF100-18-02S RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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