Z-FOAM-800-06EC Silicone Foam Gasket
- Density (g/cm³)
- 0.2±0.03
- Dielectric strength (kV/mm)
- ≥2.0
- Flame retardancy ratio
- V-0
- Flame spread index
- Qualified
- Thermal conductivity
- 0.06 W/(m·K)
- Volume resistivity (Ω·cm)
- ≥1.0×10¹⁵
Z-FOAM-800-06EC — Product overview
Z-foam™ 800-06EC Series is a low-stress silicone foaming silicone material with excellent compression resistance and permanent deformation properties. Compared with the traditional carbon foam material, the material has excellent properties of high and low temperature resistance (-60-200℃), high flame retardant (V-0) and very low smoke concentration. In addition, the material has excellent resistance to aging and weather, making it an ideal material for shock absorption, cushioning, sound insulation, protection, insulation and fire protection.
Z-FOAM-800-06EC — Features
High and low temperature resistance - 60-200 ° C
Good cushioning and high compression
Resistance to ultraviolet light、ozone
Provides enhanced sealing performance
Compressed after using a good recovery
Where this grade is used
Typical application targets for this grade include Car Battery, Traffic Equipment, Communication & Electrical Equipment, Electronic products, Charging Pile.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
Z-FOAM-800-06EC — datasheet specifications
Values below are transcribed from the official datasheet (PDF: Z-Foam800-06EC-Series-Silicone-Foam-Specifications-(E).pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | White | Visual |
| Density (g/cm³) | 0.2±0.03 | ASTM D1056 |
| Compressive stress, 25% | 20±3 kPa | ASTM D1056 |
| Compression permanent deformation | ≤3.0 % | ASTM D1056 |
| Tensile strength | ≥0.3 MPa | GB/T 528-2009 |
| Elongation | ≥90 % | GB/T 528-2009 |
| Bibulous rate | ≤5.0 % | ASTM D570 |
| Environmental testing | Qualified | ROHS |
| Flame spread index | Qualified | ASTM E162 |
| Burning smoke concentration | Qualified | ASTM E662-2015 |
| Combustion of toxic gases | Qualified | SMP 800-C-2009 |
| Low temperature bending | -55°C Qualified | ASTM D1056 |
| Dielectric strength (kV/mm) | ≥2.0 | GB/T 1695-2005 |
| Volume resistivity (Ω·cm) | ≥1.0×10¹⁵ | GB/T 1695-2005 |
| Flame retardancy ratio | V-0 | E331100 |
| Thermal conductivity | 0.06 W/(m·K) | ASTM D5930 |
* Match values to the PDF revision cited on your purchase order.
Related silicone foam gaskets models
Z-FOAM-800-06EC — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is specified for Z-FOAM-800-06EC?
Typical tables list mechanical and safety-related properties — for example colour, hardness (Shore C), density, tensile strength, compression ratio at stated pressure, dielectric constant @ 1 MHz, temperature range, and UL94 flame rating. Values are grade-specific; use the documentation linked on this page as the contractual reference.
Can Ziitek supply Z-FOAM-800-06EC die-cut or with adhesive backing?
Yes — send DXF/DWG outlines, target thickness, and whether you need PSA. Silicone foam gaskets materials are converted routinely; tolerances depend on foam grade and geometry.
Where is the documentation for Z-FOAM-800-06EC?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is Z-FOAM-800-06EC suitable for flame-retarded enclosures?
UL94 class and file references are stated per grade in the technical documentation (e.g. V-0 tiers). Confirm the rating against your enclosure standard and system-level tests.
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