TIF500-75-11US Silicone Thermal Pad
- Breakdown Voltage (V/mm)
- ≥5500
- Density (g/cm³)
- 3.45
- Dielectric Constant @1MHz
- 8.0
- Flame Rating
- V-0
- Hardness (Shore OO)
- 20~50
- Recommended Operating Tem…
- -40~200
TIF500-75-11US — Product overview
TIF®500-75-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
TIF500-75-11US — Features
Excellent thermal conductivity
Super soft and highly compliant
Self-adhesive without the need for additional surface adhesives
Good insulation performance
Where this grade is used
Typical application targets for this grade include AI Servers, Semiconductor Packaging, Low-Altitude Aircraft, Optical Communication Products, 5G Base Stations.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
TIF500-75-11US — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF500-75-11US_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Dark Gray | Visual |
| Construction | Ceramic filled silicone elastomer | — |
| Thickness Range | 0.020~0.030" (0.50~0.75 mm) / 0.040~0.200" (1.00~5.00 mm) | ASTM D374 |
| Hardness (Shore OO) | 50 / 20 | ASTM D2240 |
| Density (g/cm³) | 3.45 | ASTM D792 |
| Recommended Operating Temperature (°C) | -40~200 | — |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 8.0 | ASTM D150 |
| Volume Resistivity (Ω·cm) | >1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m·K) | 7.5 | ASTM D5470 / ISO22007 |
| Flame Rating | V-0 | UL94 (E331100) |
* Match values to the PDF revision cited on your purchase order.
Related silicone thermal pads models
| Model | Series | λ (W/m·K) | Hardness | View |
|---|---|---|---|---|
| TIF100-10-02S | TIF100 | 1 W/m·K | 45 | Details |
| TIF100-12-66U | TIF100 | 1.2 W/m·K | 27~65 | Details |
| TIF100-15-11U | TIF100 | 1.5 W/m·K | 27~65 | Details |
| TIF100-18-02S | TIF100 | 1.8 W/m·K | 45~65 | Details |
| TIF500-18-11US | TIF500 | 1.8 W/m·K | 20~65 | Details |
| TIF100-20-05E | TIF100 | 2 W/m·K | 35~65 | Details |
| TIF200-20-14S | TIF200 | 2 W/m·K | 45±5 | Details |
| TIF400 | TIF400 | 2 W/m·K | 45 | Details |
TIF500-75-11US — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF500-75-11US?
The customer workbook lists nominal through-plane conductivity as 7.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF500-75-11US die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF500-75-11US?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF500-75-11US RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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