TIF020AB-19S — Thermal putty and thermal gel (2 W/m·K nominal) — gallery view 1 of 1

TIF020AB-19S Thermal Gel

Density (g/cm³)
3.2
Dielectric Constant
3.8
Flame Rating
V-0
Hardness
45 Shore OO
Thermal Conductivity (W/m·K)
2.0
Viscosity as Mixed
550 Pa·s
Download TIF020AB-19S datasheet (PDF)
Overview

TIF020AB-19S — Product overview

TIF™ 020AB-19S Series is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual di-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.

Features

TIF020AB-19S — Features

  • Good thermal conductivity

  • Two-part formulation for easy storage

  • Excellent low and high temperature mechanical and chemical stability

  • Ultra-conforming low-stress interface application

  • Ambient or accelerated cure schedules

  • Optimized shear thinning characteristics for ease of dispensing

Technical specifications

TIF020AB-19S — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF020AB-19S-TDS_EN_REV02.2.pdf). Use the linked PDF for sign-off and lot-specific CoA.

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TIF020AB-19Sdatasheet property table
ParameterValue (typical / as stated)Method / note
Typical Uncured Material
Color/Part AWhiteVisual
Color/Part BYellowVisual
Viscosity as Mixed550 Pa·sGB/T 10247
Density (g/cm³)3.2ASTM D792
Mix Ratio1:1
Shelf Life@25°C (months)6
Cure Schedule
Pot Life @ 25°C30 minZiitek Test Method
Cure @ 25°C60 minZiitek Test Method
Cure @ 100°C30 minZiitek Test Method
Cure Properties
ColorYellowVisual
Hardness45 Shore OOASTM D2240
Continuous Use Temp-45 ~ 200°CZiitek Test Method
Voltage Strength275 V/milASTM D149
Dielectric Constant3.8ASTM D150
Volume Resistivity≥1.0*10¹² Ω·cmASTM D257
Flame RatingV-0UL94
Thermal Conductivity (W/m·K)2.0ISO22007-2
Specific heat capacity2.3 MJ/m³KISO22007-2

* Match values to the PDF revision cited on your purchase order.

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FAQ

TIF020AB-19S — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF020AB-19S?

The customer workbook lists nominal through-plane conductivity as 2 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF020AB-19S die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF020AB-19S?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF020AB-19S RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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